Semiconductor dry etch equipment uses plasma to selectively remove material from semiconductor wafers during chip fabrication. This critical process enables precise pattern transfer for advanced nodes (below 7nm) by employing reactive ion etching (RIE), deep reactive ion etching (DRIE), and other plasma-based techniques. The technology is essential for creating transistors, interconnects, and 3D NAND structures in modern semiconductor manufacturing.

The market growth is driven by surging demand for advanced logic and memory chips, particularly from AI and 5G applications. While foundries and IDMs are accelerating capacity expansions, geopolitical tensions are reshaping regional supply chains. Key players like Lam Research and Tokyo Electron are investing heavily in atomic-level etching capabilities to support sub-3nm nodes. Recent developments include Applied Materials’ May 2024 launch of their Sym3 Y etch system, which promises 15% better selectivity for advanced packaging applications.

Get Full Report with trend analysis, growth forecasts, and Future strategies : https://semiconductorinsight.com/report/global-semiconductor-dry-etch-equipment-market/

Segment Analysis:

By Type

Dielectric Etch Segment Holds Major Share Driven by Advanced Node Semiconductor Manufacturing Requirements

The global semiconductor dry etch equipment market is segmented by type into:

• Silicon Etch
  • Subtypes: Deep silicon etching, shallow silicon etching
• Dielectric Etch
  • Subtypes: Oxide etch, nitride etch, low-k dielectric etch
• Conductor Etch
  • Subtypes: Metal etch, poly-silicon etch

By Application

Foundry Segment Dominates Due to Rising Demand for Advanced Logic and Memory Chips

The market is segmented by application into:

• IDM (Integrated Device Manufacturers)
• Foundry
• MEMS (Microelectromechanical Systems)
• Advanced Packaging

By Technology

ICP (Inductively Coupled Plasma) Technology Leads Owing to Superior Etch Precision and Control

• Reactive Ion Etching (RIE)
• Inductively Coupled Plasma (ICP)
• Deep Reactive Ion Etching (DRIE)
• Plasma Etching

By Wafer Size

300mm Wafers Account for Majority Share Due to Higher Production Efficiency

• 200mm
• 300mm
• 450mm (Emerging)

Regional Analysis: Global Semiconductor Dry Etch Equipment Market

North America
The North American semiconductor dry etch equipment market is driven by advanced semiconductor fabrication facilities and strong R&D investments, particularly in the U.S. The region holds a significant market share due to the presence of major semiconductor manufacturers like Intel, Micron, and GlobalFoundries, alongside leading equipment suppliers such as Lam Research and Applied Materials. The U.S. CHIPS and Science Act, allocating $52 billion to bolster domestic semiconductor production, has accelerated demand for dry etch systems for advanced nodes (sub-10nm and below). Canada and Mexico are also emerging as secondary hubs, with increased focus on automotive and IoT semiconductor applications.

Europe
Europe’s dry etch equipment market is characterized by high-precision manufacturing demands and a strong focus on MEMS and power semiconductor production. Countries like Germany, France, and the Netherlands host leading research institutes and fabs requiring specialized etching solutions. However, the market faces challenges due to slower adoption of cutting-edge nodes compared to Asia-Pacific. The European Chips Act, aiming to double the region’s semiconductor market share to 20% by 2030, is expected to drive investments in dry etch technologies, particularly for applications in automotive and industrial IoT.

Asia-Pacific
Asia-Pacific dominates the global dry etch equipment market, accounting for over 65% of worldwide demand, primarily due to expansive semiconductor fabrication in Taiwan (TSMC), South Korea (Samsung, SK Hynix), and China (SMIC). China’s aggressive push for semiconductor self-sufficiency through initiatives like “Made in China 2025” has significantly increased dry etch equipment procurement, though U.S. export controls pose challenges. Japan remains a key player in etch process innovation, with Tokyo Electron and Hitachi High-Tech leading advancements in conductor and dielectric etching. Southeast Asia is emerging as a growth area, with new fabs in Singapore and Malaysia.

South America
The South American market represents a nascent but growing segment, primarily serviced by international equipment suppliers. Brazil and Argentina show limited but steady demand for dry etch systems, mainly for analog and power semiconductor production. Economic instability and lack of large-scale wafer fabs constrain market growth; however, increasing electronics manufacturing in the region presents long-term opportunities. Most equipment is imported, with local maintenance and support networks still developing.

Middle East & Africa
This region is in the early stages of semiconductor infrastructure development, with Saudi Arabia and UAE making strategic investments to diversify into high-tech industries. The 2023 partnership between Saudi Arabia’s Vision 2030 initiative and Taiwan’s PSMC to build a $5 billion wafer fab signals growing demand for dry etch solutions. Africa’s market remains largely untapped, though South Africa shows potential for MEMS and sensor production. The primary challenge is the lack of established supply chains and technical expertise required for advanced semiconductor manufacturing.

MARKET OPPORTUNITIES

Emerging 3D IC and Advanced Packaging Technologies Open New Applications

The semiconductor industry’s shift toward 3D integration and heterogeneous packaging creates substantial growth opportunities for dry etch equipment. Advanced packaging techniques such as through-silicon vias (TSVs), hybrid bonding, and silicon interposers all require specialized etch capabilities. As packaging technology moves from the back-end to being a critical differentiator in system performance, etch equipment designed specifically for packaging applications represents a fast-growing $1.5 billion market segment. Leading manufacturers are now developing dedicated etch platforms capable of handling both wafer-level and panel-level packaging requirements with superior throughput and yield.

Expansion into Non-Traditional Semiconductor Materials Creates New Markets

The diversification of semiconductor applications into areas such as photonics, MEMS, and power electronics presents additional avenues for dry etch equipment growth. Wide bandgap materials like gallium nitride (GaN) and silicon carbide (SiC) require specialized etch chemistries and processes that differ significantly from traditional silicon etching. With compound semiconductor device markets projected to grow at over 20% annually, equipment manufacturers have a significant opportunity to develop tailored solutions for these emerging technologies. The MEMS sector also continues to demand increasingly sophisticated etch capabilities for applications ranging from inertial sensors to microfluidic devices.

Integration of AI and Machine Learning Enhances Process Control

The application of artificial intelligence to dry etch process control represents a transformative opportunity for the industry. Advanced machine learning algorithms can analyze vast amounts of sensor data to optimize etch parameters in real-time, potentially improving process stability by up to 30%. Several leading equipment vendors have begun incorporating AI-powered systems that can predict maintenance needs before tool failures occur, significantly reducing unplanned downtime. These intelligent systems also enable faster process development cycles by identifying optimal parameter combinations from historical data, potentially cutting development time in half for certain applications.

SEMICONDUCTOR DRY ETCH EQUIPMENT MARKET TRENDS

Transition to Smaller Process Nodes Drives Advanced Etch System Adoption

The semiconductor industry’s relentless pursuit of miniaturization has pushed dry etch equipment capabilities to new frontiers. With leading foundries now mass-producing chips at 3nm process nodes and developing sub-2nm technologies, plasma etching precision requirements have become exponentially more stringent. This transition demands equipment capable of atomic-level material removal with aspect ratios exceeding 40:1 in advanced DRAM and 3D NAND applications. Manufacturers are responding with new reactive ion etchers featuring AI-powered process control, improved plasma uniformity (<1% variance), and real-time endpoint detection systems—technologies now considered essential for next-generation fabrication. The market has seen a notable shift toward high-aspect-ratio contact (HARC) etching solutions, which accounted for over 35% of equipment sales in advanced logic manufacturing last year.

Other Trends

Composite Material Processing Requirements

The proliferation of novel semiconductor materials beyond silicon is fundamentally changing dry etch system requirements. Emerging high-mobility channel materials like silicon-germanium (SiGe) and gallium nitride (GaN) require specialized etch chemistries and chamber designs. For power semiconductors, where GaN adoption grew by 28% year-over-year, manufacturers are deploying atomic-layer etch (ALE) systems capable of sub-nanometer material removal precision. Similarly, the integration of low-k dielectrics in advanced packaging—now found in 72% of high-performance computing chips—has spurred demand for damage-free etching solutions that maintain fragile porous structures.

Sustainability Initiatives Reshape Equipment Design Priorities

Environmental regulations and ESG commitments are driving significant innovation in etch equipment design. Modern systems now incorporate closed-loop gas recycling that reduces greenhouse gas emissions by up to 45% compared to previous generations, while power optimization features cut energy consumption by nearly 30%. The industry shift is evident in recent RFQ specifications, where 87% now include explicit sustainability performance requirements. Equipment vendors are responding with modular designs that allow component upgrades rather than full system replacement, extending operational lifespans and reducing carbon footprints. These developments coincide with chipmakers committing to net-zero fabs—a transition expected to drive $2.8 billion in ‘green’ semiconductor equipment investments through 2027.

COMPETITIVE LANDSCAPE

Key Industry Players

Market Leaders Focus on Technological Innovation to Maintain Competitive Edge

The global semiconductor dry etch equipment market features a highly concentrated competitive landscape, dominated by established players with significant technological expertise. Lam Research currently leads the market with an estimated 45% share in the plasma etch segment, benefiting from its deep etching capabilities and strong relationships with leading foundries. Their recent introduction of the Sense.i etching system has further solidified their position in advanced node manufacturing.

Tokyo Electron Limited (TEL) and Applied Materials follow closely, collectively accounting for approximately 30% of the market. TEL’s strength lies in its comprehensive etch solutions portfolio, while Applied Materials maintains competitiveness through its integrated materials engineering approach. Both companies reported double-digit revenue growth in their etch segments during the past fiscal year, driven by high demand for 3D NAND and DRAM manufacturing equipment.

Meanwhile, regional players like NAURA in China and SEMES in South Korea are gaining traction through government-supported semiconductor localization initiatives. NAURA’s market share in China’s domestic semiconductor equipment market grew to 15% in 2023, reflecting the broader industry trend of supply chain regionalization.

The competitive intensity is further heightened by ongoing R&D investments, with leading companies dedicating 12-15% of their revenues to developing next-generation etching technologies. Atomic layer etching (ALE) and high-aspect-ratio etching capabilities have become key differentiators, particularly for advanced logic and memory applications below 7nm nodes.

List of Key Semiconductor Dry Etch Equipment Companies

• Lam Research Corporation (U.S.)
• Tokyo Electron Limited (Japan)
• Applied Materials, Inc. (U.S.)
• Hitachi High-Tech Corporation (Japan)
• SEMES Co., Ltd. (South Korea)
• Advanced Micro-Fabrication Equipment Inc. (AMEC) (China)
• NAURA Technology Group Co., Ltd. (China)
• SPTS Technologies (a KLA company) (U.K.) 
• Oxford Instruments (U.K.)
• ULVAC, Inc. (Japan)

Learn more about Competitive Analysis, and Global Forecast of Global Semiconductor Dry Etch Equipment Market : https://semiconductorinsight.com/download-sample-report/?product_id=95920

FREQUENTLY ASKED QUESTIONS:

What is the current market size of Global Semiconductor Dry Etch Equipment Market?

-> Semiconductor Dry Etch Equipment Market size was valued at US$ 3.84 billion in 2024 and is projected to reach US$ 6.27 billion by 2032, at a CAGR of 7.13%.

Which key companies operate in Global Semiconductor Dry Etch Equipment Market?

-> Key players include Lam Research, Tokyo Electron Limited, Applied Materials, Hitachi High-Tech, SEMES, AMEC, and NAURA.

What are the key growth drivers?

-> Key growth drivers include rising demand for advanced logic and memory chips, transition to smaller process nodes (below 7nm), and increasing semiconductor manufacturing capacity globally.

Which region dominates the market?

-> Asia-Pacific dominates with over 60% market share, followed by North America and Europe.

What are the emerging trends?

-> Emerging trends include adoption of atomic layer etching, increasing use of AI for process optimization, and development of dry etch solutions for advanced packaging applications.

CONTACT US:

City vista, 203A, Fountain Road, Ashoka Nagar, Kharadi, Pune, Maharashtra 411014 
+91 8087992013 
help@semiconductorinsight.com

Follow us on LinkedIn: https://www.linkedin.com/company/semiconductor-insight/