Global LGA Packaging Market, Trends, Business Strategies 2025-2032
  The global LGA Packaging Market was valued at 401 million in 2024 and is projected to reach US$ 674 million by 2032, at a CAGR of 7.9% during the forecast period. LGA (Land Grid Array) Packaging is an advanced semiconductor packaging technology that offers a thinner and lighter profile compared to traditional BGA (Ball Grid Array) packages. By eliminating solder balls and using flat...
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