Land Grid Array (LGA) Packaging Market : Industry Analysis on Trends, Regional insights, and Global forecast to 2032
    The global Land Grid Array (LGA) Packaging Market was valued at 401 million in 2024 and is projected to reach US$ 674 million by 2032, at a CAGR of 7.9% during the forecast period. Land Grid Array (LGA) packaging is an advanced semiconductor packaging technology that improves upon traditional Ball Grid Array (BGA) solutions. Unlike BGA packages that use solder balls, LGA...
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