2.5D and 3D TSV market - Industry Analysis, By Key Players, Segmentation, Application, Demand And Forecast 
According to a new report from Intel Market Research, the global 2.5D and 3D TSV market was valued at USD 9.87 billion in 2024 and is projected to reach USD 23.65 billion by 2032, growing at an impressive CAGR of 14.0% during the forecast period (2025–2032). This growth trajectory reflects the critical role of Through-Silicon Via technology in enabling next-generation semiconductor...
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